產品與市場
S1150GH
特點
● 無鉛兼容及優異的耐離子遷移性能
● 低的Z軸熱膨脹系數
● 適用高端HDI性能加工需求
應用領域
● 消費電子
● 智能手機,平板電腦,筆記本
● LED,游戲設備
- 產品性能
- 產品證書
- 資料下載
Items | Method | Condition | Unit | Typical Value | ||
---|---|---|---|---|---|---|
Tg | IPC-TM-650 2.4.24.4 | DSC | ℃ | 160 | ||
|
|
DMA |
℃ |
170 | ||
Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 400 | ||
CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 35 | ||
After Tg | ppm/℃ | 189 | ||||
50-260℃ | % | 2.3 | ||||
T260 | IPC-TM-650 2.4.24.1 | TMA | min | 60 | ||
T288 | IPC-TM-650 2.4.24.1 | TMA | min | 60 | ||
Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | -- | pass | ||
Volume Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ.cm | 6.0 x 108 | ||
Surface Resistivity | IPC-TM-650 2.5.17.1 | C-96/35/90 | MΩ | 8.0 x 107 | ||
Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 148 | ||
Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 45+kV NB | ||
Dissipation Constant (Dk) RC50% |
IPC-TM-650 2.5.5.9 | 1GHz | -- | 4.30 | ||
Dissipation Factor (Df) RC50% | IPC-TM-650 2.5.5.9 | 1GHz | -- | 0.010 | ||
Peel Strength (1Oz HTE copper foil) | IPC-TM-650 2.4.8 |
|
N/mm | 1.35 | ||
Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 550 | |
CW | IPC-TM-650 2.4.4 | A | MPa | 430 | ||
Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.09 | ||
Flammability | UL94 | C-48/23/50 | Rating | V-0 | ||
E-24/125 | Rating | V-0 |
Remarks:
Remark:
1. All the typical value is based onthe 1.6mm (8*7628) specimen. The Dk and Df value is based on 50% RC.
2. All the typical value listed above isfor your reference only, please turn to Shengyi Technology Co., Ltd fordetailed information, and all rights from this data sheet are reserved by ShengyiTechnology Co., Ltd.
Explanations:C=Humidity conditioning; D=Immersion conditioning in distilled water;E=Temperature conditioning.
The figures following the letter symbolsindicate with the first digit the duration of the preconditioning in hours,with the second digit the preconditioning temperature in ℃ and with the third digit the relative humidity.